“Thin” low adhesion High Insulation masking tape for epoxy molding(prevents epoxy leakage) with fluorosilicone liner | Deantape

Masking Tapes

“Thin” low adhesion High Insulation masking tape for epoxy molding(prevents epoxy leakage) with fluorosilicone liner
Custom size, die-cutting parts can be provided as required ☏ sales@deantape.com

Thin low adhesion High Insulation masking tape is a highly heat-resistant and excellent insulation effect with fluorosilicone release liner. It is high wettability that prevents epoxy leakage. In addition, the product is laminated with fluorosilicone release liner which can be supplied as die-cut. It is also used for the high insulation masking process.

 

* Generally used silicone tape
* High heat resistance and Excellent Insulation effect
* High wettability -preventing epoxy leakage
* Laminated with Fluorosilicone Release Liner – can be supplied as die-cut
* No residue after insulation process
* Used for high insulation masking process

 

ST-8332FL
Polyimide based silicone PSA tape
FL liner is added
Total thickness: 35um
Peel strength: 35gf/in
Temperature resistance: 240C x 10 min (removed cleanly)
Color: Amber

Feature Heat-Resistant, Fluorosilicone Release Liner
Brand Name [DT] Masking tape
Material Polyimide
Model Number: ST-8332FL
Adhesive: Silicone
Adhesive type: Pressure Sensitive
Color Amber
Price Negotiable
MOQ Negotiable
Feature Resistant, Fluorosilicone Release Liner