Industrial Adhesive Tapes | Business & Products | Deantape

Semiconductor

MASKING Tape for QFN PKG
HTR tape for semiconductor CSP package manufacturing process

Mainly used during the process of QFN packaging, this is applied to the EMC resin sealing process by using excellent heat-resistant polyimide films. It shows good initial tack and unrolls well even during the work process at high temperatures as well as excellent workability during the wire-bonding process.

◈ Custom size, die-cutting parts can be provided as required ☏ sales@deantape.com

Grade No Backing Thickness
(mm)
Total Thickness
(mm)
Color Adhesive Adhesion
SUS (gf/25mm)
Liner
8331SRN PI 0.025 0.028 Amber Silicone 430 Trans polyester
8331SLN PI 0.025 0.030 Amber Silicone 60 Trans polyester
870SE PI 0.025 0.055 Amber Silicone 460 Trans polyester