(F)PCB

Heat resistant masking tape for manufacturing EAD substrates

 

 This product is used to protect auxiliary molding and substrates for manufacturing EAD substates. By using high heat-resistant polyimide films and silicon PSA, it has good shrink-resistance against deformation that may occur during the process. In addition, the specially manufactured silicon PSA provides workability without any residues and contamination even under high temperature and high pressure conditions.